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环境应力试验[JDa1]     JESD22-A100-B Cycled Temperature-Humidity-Bias Life Test 上电温湿度循环寿命试验, (Revision of JESD22-A100-A) April 2000 [Text-jd001][JDa2]     JESD22-A101-B Steady State Temperature Humidity Bias Life Test 上电温湿度稳态寿命试验, (Revision of JESD22-A101-A) April 1997 [Text-jd002][JDa3]     JESD22-A102-C Accelerated Moisture Resistance -Unbiased Autoclave高加速蒸煮试验, (Revision of JESD22-A102-B) December 2000 [Text-jd003][JDa4]     JESD22-A103-A Test Method A103-A High Temperature Storage Life高温储存寿命试验, (Revision of Test Method A103 Previously Published inJESD22-B) July 1989 [Text-jd004][JDa5]     JESD22-A103-B High Temperature Storage Life高温储存寿命试验, (Revision of JESD22-A103-A) August 2001 [Text-jd005][JDa6]     JESD22-A104-B Temperature Cycling温度循环, (Revision of JESD22-A104-A) July 2000 (参见更新版本A104C) [Text-jd006][JDa7]     EIA/JESD22-A105-B Test Method A105-B Power and Temperature Cycling上电和温度循环, (Revision of Test Method A105-A) February 1996 [Text-jd007][JDa8]     JESD22-A106-A Test Method A106-A Thermal Shock热冲击, (Revision of Test Method A106-Previously Published inJESD22-B) April 1995 [Text-jd008][JDa9]     JESD22-A107-A Salt Atmosphere盐雾试验, (Revision of Test Method A107-Previously Published in JESD22-B) December1989 [Text-jd009][JDa10]  JESD22-A108-B Temperature, Bias, and Operating Life高温环境条件下的工作寿命试验, (Revision of JESD22-A108-A) December 2000[JDa11]  JESD22-A110-B Test Method A110-B Highly-Accelerated Temperature andHumidity Stress Test (HAST)高加速寿命试验, (Revision of TestMethod A110-A) February 1999 [Text-jd010][JDa12]  JESD22-A113-B Preconditioning of Nonhermetic Surface Mount DevicesPrior to Reliability Testing非密封表贴器件在可靠性试验以前的预处理, (Revision of Test Method A113-A) March 1999 [Text-jd011][JDa13]  JESD22-A118 Accelerated Moisture Resistance - Unbiased HAST不上电的高加速湿气渗透试验, December 2000 [Text-jd012][JDa14]  JESD22-B106-B Test Method B106-B Resistance to Soldering Temperaturefor Through-Hole Mounted Devices插接器件的抗焊接温度试验, (Revision of Test Method B106-A) February 1999 [Text-jd013][JDa15]  EIA/JESD47 Stress-Test-Driven Qualification of Integrated Circuits集成电路施加应力的产品验收试验, July 1995 [Text-jd031][JDa16]  JESD22-A104C Temperature Cycling, (Revision of JESD22-A104-B) May2005 [Text-jd040]  电应力和电测试试验[JDb1]     JESD22-A114-B Electrostatic Discharge (ESD) Sensitivity Testing HumanBody Model (HBM)人体模型条件下的静电放电敏感度试验, (Revision ofJESD22-A114-A) June 2000 [Text-jd014][JDb2]     EIA/JESD22-A115-A Electrostatic Discharge (ESD) Sensitivity TestingMachine Model (MM)机器模型条件下的静电放电敏感度试验, (Revision of EIA/JESD22-A115) October 1997 [Text-jd015][JDb3]     JESD22-A117 Electrically Erasable Programmable ROM (EEPROM)Program/Erase Endurance and Data Retention Test EEPROM的擦涂和数据保存试验, January 2000 [Text-jd016][JDb4]     EIA/JESD78 IC Latch-Up Test集成电路器件闩锁试验, March 1997 [Text-jd017][JDb5]     JESD22-C101-A Field-Induced Charged-Device Model Test Method forElectrostatic-Discharge-Withstand Thresholds of Microelectronic Components微电子器件在电荷感应模型条件下的抗静电放电试验, (Revision of JESD22-C101) June 2000  [Text-jd018] 机械应力试验[JDc1]      JESD-22-B103-A Test Method B103-A Vibration, Variable Frequency振动和扫频试验 (Revision of Test Method B103 Previously Published inJESD22-B) July 1989 [Text-jd019][JDc2]      JESD22-B104-A Test Method B104-A Mechanical Shock机械冲击 (Revision of Test Method B104, Previously Published inJEDEC Standard No.22-B) September 1990 [Text-jd020][JDc3]      EIA/JESD22-B116 Wire Bond Shear Test Method焊线邦定的剪切试验方法, July 1998 [Text-jd021][JDc4]      JESD22-B117 BGA Ball Shear BGA焊球的剪切试验, July 2000 [Text-jd022][JDc5]      JESD22B113 Board LevelCyclic Bend Test Method for Interconnect Reliability Characterization ofComponents for Handheld Electronic Products, March 2006 [Text-jd038][JDc6]      JESD22-B111 Board LevelDrop Test Method of Components for Handheld Electronic Products, July 2003 [Text-jd039] 综合试验与测试[JDd1]     JEDEC Standard No.22-A109 Test Method A109 Hermeticity密封性试验, July 1988 [Text-jd023][JDd2]     JESD22-A120 Test Method for the Measurement of Moisture Diffusivityand Water Solubility in Organic Materials Used in Integrated Circuits集成电路器件中使用的有机材料水分扩散和水溶性测定试验方法, June 2001 [Text-jd024][JDd3]     JESD22-B100-A Physical Dimensions物理尺寸的测量, (Revision of Test Method B100-Previously Published in JESD22-B) April1990 [Text-jd025][JDd4]     JESD22-B101 Test Method B101 External Visual外观检查, (Previously published in JESD22-B) September 1987 [Text-jd026][JDd5]     EIA/JESD22-B102-C Solderability Test Method可焊性试验方法, September 1998 [Text-jd027][JDd6]     EIA/JESD22-B105-B Test Method B105-B Lead Integrity器件管脚的完整性试验, (Revision of Test Method B105-A) January 1999 [Text-jd028][JDd7]     EIA/JESD22-B107-A Test Method B107-A Marking Permanency图标的耐久性试验, (Revision of Test Method B107-Previously Published inJESD22-B) September 1995 [Text-jd029][JDd8]     JESD22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices表贴半导体器件的共面性试验, November 1991 [Text-jd030] 其它[JDe1]      JEP113-B Symbol and Labels for Moisture-Sensitive Devices湿度敏感器件的符号和标识, (Revision of JEP113-A) May 1999 [Text-jd032][JDe2]      EIA/JEP122 Failure Mechanisms and Models for Silicon SemiconductorsDevices硅半导体器件的失效机理和模型, February 1996 [Text-jd033][JDe3]      IPC/JEDEC J-STD-020A Moisture/Reflow Sensitivity Classification forNonhermetic Solid State Surface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, April 1999 [Text-jd034][JDe4]      IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/ReflowSensitive Surface Mount Devices湿度/回流焊敏感标贴器件的处理、包装、运输和使用的标准, May 1999 [Text-jd035][JDe5]      EIA/JEP103-A SuggestedProduct-Documentation Classifications and Disclaimers, (Revision of JEP103)July 1996 [Text-jd036][JDe6]      IPC/JEDEC J-STD-020D.1 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid StateSurface Mount Devices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别, Supersedes IPC/JEDEC J-STD-020D August 2007, March 2008[Text-jd037]



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